microTEC develops and produces microsystems and components. Our patented high precision 3D-printing technologies solve packaging and interconnection challenges and offer cost and time benefits.
We support lifescience companies with customized microsystems and microfluidics for electrical and optical analysis.
For medial applications we develop micro-mechanical parts with integrated sensors. A wide range of micro-actuators, micro-needles, micro-filters with high aspect ratios and electrode fixtures are available.
The MEMS packaging method 3D-CSP offers flexibility in selecting and arrangement of elements, as well as considerable quality and cost advantages compared to TSV or wafer level packaging.
Telecommunication and automobile
We produce micro-mechatronic and multi-material MEMS and drive the miniaturization for camera modules, mechanical and optical-electronic interconnection elements and lens integration.
Phone: +49.203.306.2050 – E-mail: firstname.lastname@example.org
Phone US: +1.415.415.9954 – E-mail: email@example.com