March 2019

Visit us in Berlin! Join the conference and exhibition on “Microelectronics for Industry 4.0” on March 21st -22nd, 2019

Internet of Things, Industry 4.0, Smart-Items-Infrastructures: Learn more about the latest results on 3D-CSP based packaging and assembly solutions for production environments.

Listen to the presentation „Freiformsensorik für Smart-Items-Infrastrukturen in Produktionsumgebungen“, given by René Grünke, Schaeffler Technologies AG & Co. KG, on Thursday, 21st, at 5:30 pm. The project has been funded by the German BMBF.

Flyers available for download here: