3D-CSP
3-Dimensionales Chip Size Packaging: microTEC’s Verfahren zur Integration von Mikromechanik, Mikrofluidik, Mikrooptik oder Mikroelektronik auf kleinstem Raum, kosteneffizient durch parallele Fertigung.

 

                                                                                                                      Produkt Gallerie

 

Sensor-package-solutio
hot wire anemometer
3D-CSP ,LGA for sensor modul
2 piezoelectric micro motors
wireless pressure sensors
Sensor Modul
closed cantilever module, connector on side
vcsel
CMOS Chip with NLTL and Vivaldi antenna
3D_CSP
SAW
Pressure
packaging
Light-Pads
LED
IMG_0518
CSP
3D-CSP