microTEC develops and produces micro systems and components. Our technologies with innovative packaging and interconnection technologies offer cost and time benefits.
Micro systems technology and fluidics for synthesis and analysis (electrical and optical).
Micro mechanical parts and parallel integration of sensors: micro-actuators, micro-needles, micro-filters with high aspect ratios, electrode fixtures.
The MEMS packaging method 3D-CSP offers flexibility in selecting and arrangement of elements, as well as considerable quality and cost advantages compared with TSV or wafer level packaging.
Telecommunication and automobile
Micro mechatronic and multi-material MEMS: miniaturisation for camera modules, mechanical and optical-electronic interconnection elements, lens integration, manufacture of laser or LED components with passive cooling.
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