microTEC develops and produces micro systems and components. Our technologies with innovative packaging and interconnection technologies offer cost and time benefits.

Biotechnology Download
Micro systems technology and fluidics for synthesis and analysis (electrical and optical).

Medical engineering
Micro mechanical parts and parallel integration of sensors: micro-actuators, micro-needles, micro-filters with high aspect ratios, electrode fixtures.

Consumer electronics Download
The MEMS packaging method 3D-CSP offers flexibility in selecting and arrangement of elements, as well as considerable quality and cost advantages compared with TSV or wafer level packaging.

Telecommunication and automobile
Micro mechatronic and multi-material MEMS: miniaturisation for camera modules, mechanical and optical-electronic interconnection elements, lens integration, manufacture of laser or LED components with passive cooling.

Contact us:
Fon: +49 203 306 2050 and +49 6322 650 220 - Email: info@microtec-d.com